
Meet the recipients of the 2026 IEEE Medals—the group’s highest-level honors. Introduced on behalf of the IEEE Board of Administrators, these medals acknowledge innovators whose work has formed fashionable expertise throughout disciplines together with AI, training, and semiconductors.
The medals will likely be introduced on the IEEE Honors Ceremony in April in New York Metropolis. View the total record of 2026 recipients on the IEEE Awards web site, and comply with IEEE Awards on LinkedIn for information and updates.
Sponsor: IEEE
Santa Clara, Calif.
“For management within the improvement of graphics processing models and their software to scientific computing and synthetic intelligence.”
Sponsor: IBM
Pittsburgh
“For contributions to the development of societal enchancment and training by means of modern expertise.”
Sponsor: Nokia Bell Labs
College of California, Berkeley
“For contributions to Web structure, community useful resource allocation, and software-defined networking.”
Sponsor: Mani L. Bhaumik
Co-recipients:
Erik Dahlman
Stefan Parkvall
Johan Sköld
Stockholm
“For contributions to and management within the analysis, improvement, and standardization of mobile wi-fi communications.”
Sponsor: Google
Medford, Mass.
“For contributions to pc imaginative and prescient and simulation algorithms, and for management in growing applications to advertise STEM careers.”
Sponsor: The Edison Medal Fund
“For pioneering contributions to biomedical imaging, terrestrial optical communications and networking, and inter-satellite optical hyperlinks.”
Sponsor: Toyota Motor Corp.
“For contributions to advancing electrical security within the office, integrating renewable power and grid modernization for local weather change mitigation.”
Sponsor: IEEE Basis
Reston, Va.
“For management in communication networks, together with acceleration of digital fairness, accountable Synthetic Intelligence, and the promotion of range and inclusion.”
Sponsor: Qualcomm, Inc.
“For contributions to coding for dependable communications and networking.”
Sponsor: Associates of Nick Holonyak, Jr.
College of California, Santa Barbara
“For seminal contributions to compound semiconductor optoelectronics, together with high-efficiency seen light-emitting diodes, lasers, and LED shows.”
Sponsor: IEEE Engineering Medication and Biology Society
“For pioneering contributions to wearable affective computing for well being and wellbeing.”
Sponsor: Apple
“For contributions to sign modeling, coding, and recognition for speech communication.”
Sponsor: ARM, Ltd.
“For the event of the recollision mannequin for robust subject mild–matter interactions resulting in the sphere of attosecond science.”
Sponsor: IEEE Life Members Fund and MathWorks
James H. McClellan
“For basic contributions to electrical and pc engineering training by means of modern digital sign processing curriculum improvement.”
Sponsor: IEEE Jun-ichi Nishizawa Medal Fund
Hanover, N.H.
“For the invention, improvement, and commercialization of the CMOS picture sensor.”
Sponsor: Intel Corp.
Santa Clara, Calif.
“For pioneering parallel computing architectures and management in semiconductor design that remodeled synthetic intelligence, scientific analysis, and accelerated computing.”
Sponsor: RTX
“For contributions to polarimetric artificial aperture radar imaging and its utilization.”
Sponsors: IEEE Trade Purposes, Industrial Electronics, Energy Electronics, and Energy & Power societies
“For contributions to Z-Supply and modular multi-level converters for distribution and transmission networks.”
Sponsor: Northrop Grumman Corp.
LogiQ, Inc.
Arlington, Va.
“For management in nationwide safety, civil, and business methods engineering and improvement of chic design ideas.”
Sponsor: IBM
San Jose, Calif.
“For contributions to database question languages, notably Structured Question Language, which powers a lot of the world’s knowledge administration and evaluation methods.”
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