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Particle-free metallic ink producer Electroninks has partnered with Manz Asia introducing a silver ink formulation for digital inkjet printing in semiconductor packaging.
Curing underneath LED-UV mild at 365 nanometers, the fabric is designed for two.5D and 3D buildings the place precision and effectivity are tough to attain. Having eliminated masking from the method, it reduces manufacturing steps, improves alignment between layers, and streamlines manufacturing whereas preserving accuracy.
The formulation targets selective metallization in functions reminiscent of electromagnetic interference shielding and antenna on bundle. It adheres to epoxy molding compounds, silicon, and different frequent surfaces whereas sustaining conductivity and reliability, making it appropriate for advanced geometries in superior packaging.
In September, Electroninks showcased the fabric at SEMICON Taiwan, with demonstrations highlighting its potential to deal with irregular surfaces and function an alternative choice to standard metallization methods.
“By integrating EI’s Silver MOD Ink with Manz Asia’s in-situ LED-UV curing inkjet printing platform, we eradicate the necessity for thermal curing and streamline the manufacturing course of. This delivers sturdy adhesion, wonderful conductivity for EMI shielding, and enhanced precision in advanced 2.5D and 3D printing functions,” acknowledged by Robert Lin, CEO of Manz Asia.
Constructing on particle-free ink experience
Established in 2013, Electroninks constructed its experience on growing particle-free conductive inks, positioning them as options to nanoparticle- and flake-based supplies. Over time, the corporate expanded its portfolio to incorporate particle-free silver, gold, platinum, nickel, and copper formulations, which have been adopted in functions starting from shows and interconnects to wearable units.
In 2021, Electroninks introduced an funding from In-Q-Tel, the strategic funding arm of the U.S. intelligence neighborhood, to assist scaling manufacturing of its inks for presidency and industrial prospects. Across the similar interval, the corporate launched an enhanced silver ink tailor-made for aerosol jet printing (AJP), able to sub-20 µm options at low curing temperatures, with conductivity exceeding bulk silver.
That product underscored the corporate’s potential to ship inks suited to high-precision functions reminiscent of semiconductor packaging, sensors, and shows, offering the muse for later collaborations just like the Manz Asia mission.
“Listening to our Prospects, we hear the necessity for selective metallization at wafer and bundle stage, particularly for excessive 2.5/3D buildings. That is very difficult each on supplies and gear improvement, and dealing with tooling companions like Manz Asia is important to offer complete options to prospects,” acknowledged Melbs LeMieux, President at Electroninks.
Broader momentum in conductive ink improvement
Electroninks’ work fashioned a part of a wider development in conductive ink innovation. A decade in the past, international client electronics firm Apple filed a patent describing an inkjet 3D printer able to depositing conductive ink onto three-dimensional objects. As an alternative of counting on robotic arms to comply with floor contours, the design rotated and tilted the article itself so every nonplanar floor might face the printhead.
A fixture held parts reminiscent of circuit boards, whereas tilt and rotation mechanisms adjusted their place to reveal a number of sides for printing. The method prompt potential use in manufacturing curved sensible units and pointed towards longer-term potentialities of integrating conductive supplies into 3D printed buildings.
Elsewhere, electronics 3D printer producer Nano Dimension filed a U.S. patent for a synthesis course of that produced silver nanoparticles as small as 4 nanometers, creating a brand new class of nanometric conductive inks. By controlling particle dimension and floor properties, the method was anticipated to decrease melting temperatures, enhance sintering, and lift conductivity in printed options.
The ink was developed to spice up the efficiency of the corporate’s DragonFly 2020 3D printer, with the potential to speed up printing speeds and scale back materials use in manufacturing multilayer circuit boards, antennas, and different digital parts.
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Featured picture exhibits mage print on 2.5D/3D form. Picture through Electroninks.